LaRC TPI 1500 series polymers

The crystallization behavior and the melt flow properties of two batches of 1500 series LaRC-TPI polymers from Mitsui Toatsu Chemicals (MTC) were investigated. The characterization methods include Differential Scanning Calorimetry, the x ray diffractography and the melt rheology. The as-received materials possess initial crystalline melting peak temperatures of 295 and 305 C, respectively. These materials are less readily recrystallizable at elevated temperatures when compared to other semicrystalline thermoplastics. For the samples annealed at temperatures below 330 C, a semicrystalline polymer can be obtained. On the other hand, a purely amorphous structure is realized in the samples annealed at temperatures above 330 C. Isothermal crystallization kinetics were studied by means of the simple Avrami equation. The viscoelastic properties at elevated temperatures below and above glass transition temperature of the polymers were measured. Information with regard to the molecule sizes and distributions in these polymers were also extracted from melt rheology

All-optical wavelength and width-tunable waveform conversion using nonlinearities in semiconductor optical amplifier and highly nonlinear fiber

電気通信大学200

Adoption and Diffusion of Information Technology in Early Childhood Pedagogy: Crossing the Invisible Chasm

On a global basis, the usage of information technology in childhood pedagogy has been controversial. However, the trend of utilizing computers in preschool education is likely to gain momentum regardless of this controversy. This is particularly so for Singapore, a tiny country ranked only second to the United States in IT penetration and usage in the latest ranking by the World Economic Forum. In this regard, the attitudes of the various stakeholders (principals/administrators, teachers, and parents/guardians) are of utmost concern to both researchers and practitioners as such attitudes may shape the styles and methods of IT usage. Based on symbolic interactionism as the informing theoretical perspective, this study examines their perceptions toward IT usage in childhood pedagogy at seven preschool educational centers in Singapore. As part of our findings, we identify the existence of an “invisible” chasm and highlight factors that may be critical in crossing this chasm. In particular, we suggest possible extensions to Surry’s RIPPLES model, originally based on higher education, with accompanying implications for future research. We conclude with a proposed PIECES framework to guide effective IT usage in early childhood pedagogy

Processing Robustness for A Phenylethynyl Terminated Polyimide Composite

The processability of a phenylethynyl terminated imide resin matrix (designated as PETI-5) composite is investigated. Unidirectional prepregs are made by coating an N-methylpyrrolidone solution of the amide acid oligomer (designated as PETAA-5/NMP) onto unsized IM7 fibers. Two batches of prepregs are used: one is made by NASA in-house, and the other is from an industrial source. The composite processing robustness is investigated with respect to the prepreg shelf life, the effect of B-staging conditions, and the optimal processing window. Prepreg rheology and open hole compression (OHC) strengths are found not to be affected by prolonged (i.e., up to 60 days) ambient storage. Rheological measurements indicate that the PETAA-5/NMP processability is only slightly affected over a wide range of B-stage temperatures from 250 deg C to 300 deg C. The OHC strength values are statistically indistinguishable among laminates consolidated using various B-staging conditions. An optimal processing window is established by means of the response surface methodology. IM7/PETAA-5/NMP prepreg is more sensitive to consolidation temperature than to pressure. A good consolidation is achievable at 371 deg C (700 deg F)/100 Psi, which yields an RT OHC strength of 62 Ksi. However, processability declines dramatically at temperatures below 350 deg C (662 deg F), as evidenced by the OHC strength values. The processability of the IM7/LARC(TM) PETI-5 prepreg was found to be robust

Cure Cycle Design Methodology for Fabricating Reactive Resin Matrix Fiber Reinforced Composites: A Protocol for Producing Void-free Quality Laminates

For the fabrication of resin matrix fiber reinforced composite laminates, a workable cure cycle (i.e., temperature and pressure profiles as a function of processing time) is needed and is critical for achieving void-free laminate consolidation. Design of such a cure cycle is not trivial, especially when dealing with reactive matrix resins. An empirical "trial and error" approach has been used as common practice in the composite industry. Such an approach is not only costly, but also ineffective at establishing the optimal processing conditions for a specific resin/fiber composite system. In this report, a rational "processing science" based approach is established, and a universal cure cycle design protocol is proposed. Following this protocol, a workable and optimal cure cycle can be readily and rationally designed for most reactive resin systems in a cost effective way. This design protocol has been validated through experimental studies of several reactive polyimide composites for a wide spectrum of usage that has been documented in the previous publications

Designing Cure Cycles for Matrix/Fiber Composite Parts

A methodology has been devised for designing cure cycles to be used in the fabrication of matrix/fiber composite parts (including laminated parts). As used here, cure cycles signifies schedules of elevated temperature and pressure as functions of time, chosen to obtain desired rates of chemical conversion of initially chemically reactive matrix materials and to consolidate the matrix and fiber materials into dense solids. Heretofore, cure cycles have been designed following an empirical, trial-and-error approach, which cannot be relied upon to yield optimum results. In contrast, the present methodology makes it possible to design an optimum or nearly optimum cure cycle for a specific application. Proper design of a cure cycle is critical for achieving consolidation of a reactive matrix/fiber layup into a void-free laminate. A cure cycle for a composite containing a reactive resin matrix usually consists of a two-stage ramp-and-hold temperature profile. The temperature and the duration of the hold for each stage are unique for a given composite material. The first, lower-temperature ramp-and hold stage is called the B stage in composite- fabrication terminology. At this stage, pressure is not applied, and volatiles (solvents and reaction by-products) are free to escape. The second, higher-temperature stage is for final forced consolidation